System-level camera module with electrical support and manufacturing method thereof

ABSTRACT

A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.

CROSS REFERENCE OF RELATED APPLICATION

This is a Continuation application that claims the benefit of priorityunder 35 U.S.C. § 119 to a non-provisional application, application Ser.No. 15/057,057, filed Feb. 29, 2016, and the benefit of priority under35 U.S.C. § 120 to Chinese application number CN 201510778437.2, filingdate Nov. 13, 2015, and Chinese application number CN 201610099510.8,filing data Feb. 23, 2016, the entire contents of each of which areexpressly incorporated herein by reference.

NOTICE OF COPYRIGHT

A portion of the disclosure of this patent document contains materialwhich is subject to copyright protection. The copyright owner has noobjection to any reproduction by anyone of the patent disclosure, as itappears in the United States Patent and Trademark Office patent files orrecords, but otherwise reserves all copyright rights whatsoever.

BACKGROUND OF THE PRESENT INVENTION

Field of Invention

The present invention relates to a camera module, and more particularlyrelates to a system-level camera module with electrical support and themanufacturing method thereof.

Description of Related Arts

Conventional mobile phone camera module utilizes chip-scale packagetechnology (CSP) or chip-on-board assembly technology (COB), in whicheach electronic component is placed on the surface of the circuit board,which does not overlap each other between the electronic components. Inan autofocus camera module, in order to protect the chip which is placedon the surface of the circuit board, the support is often needed toprotect the internal components and to support the driver. With theincreasing demand of camera module pixel accuracy and function, the useof different drivers, resistors, capacitors and other electroniccomponents will be correspondingly increased, which will result in theincrease of the chip area and the increasing packaging size of thecamera module. On the other hand, the demand for camera module has notlimited to its functionality and improved pixel accuracy. As theportable electronic devices become vital products in everyday life, thedemand and supply of the portable electronic device for themanufacturers and consumers is relatively high. Accordingly, therequirements for the camera module are increasing.

Currently, the design for portable electronic devices, such as smartphones and tablet PCs, has shown a general tendency toward lightness andthinness, which requires various compact sized components of theportable electronic device (especially refers to the thickness of thecomponents) to be more compact by further reducing the sizes thereof.For example, the camera module as a standard component in a portableelectronic device has tendency toward lightness and thinness to beinstalled in the portable electronic device.

Existing mobile phone module package is conflict with the trend of phonecamera module with its thinness and miniaturization features, it isnecessary to invent a new type of compact packaging technology to meetthe demands of product development.

Referring to FIG. 1, a camera module in a prior art is illustrated,wherein the camera module comprises an optical lens 1, a motor 2, anoptical filter 3 such as a IR filter, a base holder 4, at least onemetal wire 5, a drive control member 6, a circuit board 7, aphotosensitive chip 8, at least one driver solder joint 9 and aconductor used for electrically connecting the motor 2 and the circuitboard 7. The photosensitive chip 8 is attached on the top surface of thecircuit board 7. The metal wire 5, such as copper wire, is used toconnect the photosensitive chip 8 and the circuit board 7 by wirebonding. The optical filter 3 is attached to the base 3 or the opticallens 1. After the camera module is assembled, the driver pins aresoldered in order to electrically connect to the motor 2 and the circuitboard 7. So, the circuit board 7 can provide power to the motor 2 andfurther control the operation of the motor 2.

Although such camera module has been widely used in the market, thiscamera module still has many drawbacks.

Firstly, the driver 2 has a protruded conductor which is electricallyconnected to the circuit board 7, so that the motor 2 is electricallyconnected to the circuit board 7. The conductor is connected to thecircuit board 7 through the solder joint 9. The process to connect themotor 2 and the circuit board 7 through a protruded conductor iscomplicated, and will generate many other problems, such as the productquality might be influenced by the soldering quality. Moreover, thissoldering connection by soldering the protruded conductor is not solid,which would be easily damaged during operation or maintenance process.

Furthermore, the circuit board 7 and the photosensitive chip 8 areconnected by the metal wire 5. Such electrical connection is notsecured. In addition, the base holder 4 needs to provide a relativelarge protection space for the metal wire 5 to be securely set. In otherwords, the size of the base holder 4 will be enlarged. Accordingly, thesize of the entire camera module will also be enlarged.

Furthermore, the conductor, the metal wire 5 and the drive controlmodule 6 are vulnerable to external environment, such as the dust, etc.,so as to affect the quality of the entire camera module and to reducethe service life of the entire camera module.

As mentioned above, the connection between the circuit board 7 and thephotosensitive chip 8 together with the connection between the motor 2and the circuit board 7 that both takes certain large space and aredifficult to get good protection. At the same time, the base holder 4has a large size to be connected with the circuit board 7, thephotosensitive chip 8 and the holder 2. However, it can achieveelectrical connection between the circuit board 7 and the motor 2 andbetween the circuit board 7 and the photosensitive motor 8. In addition,the base holder 4 is hardly able to provide enough protection to otherelectronic components in the camera module. It cannot provide a fullprotection from dust or other contaminants.

A new camera module to meets the development requirement of the portableelectronic product with higher performance and better structure layoutis needed.

SUMMARY OF THE PRESENT INVENTION

One objective of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein thecamera module of the present invention does not require any conventionalbase holder that is one of the main components of the conventionalcamera module.

Another objective of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein thecamera module comprises an electrical support, wherein the electricalsupport as a multipurpose support can be any predetermined shape, whichnot only serves as a conventional circuit board to electrically connectwith different camera components, such as electrical conduction forchips, drivers and other electronic components, but also serves as aconventional base holder to support the camera components, such as thephotosensitive chip, the optical filter and the driver.

Another object of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein theelectrical support integrates with the functions of the base and thecircuit board in conventional camera module to minimize unnecessarycomponents thereof so as to enhance the structure of camera module to bemore compact than the conventional one.

Another object of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein allcomponents are arranged in an organized manner to simply themanufacturing process of the camera module.

Another object of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein themetal piece of the electrical support is interconnected, when the driveris attached to the electrical support, the circuit board of the cameramodule is able to connect with the driver directly, such as usingconductive adhesive to substitute the soldering process of drivermounting to the circuit process.

Another object of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein thecamera module is suitable for flip chip method, wherein thephotosensitive sensor of the camera module can be attached to theelectrical support using flip chip method without the wire bondingprocess.

Another object of the present invention is to provide a camera modulewith electrical support and manufacturing method thereof, wherein theconnecting method of the photosensitive sensor and the photosensitivesensor pad of the camera module can be but not limited to ACP(anisotropic conductive paste), ultrasonic welding, thermo-compressionbonding, reflow soldering, and etc.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe electrical support can embed with resistors, capacitors, IC andother electronic components.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe resistors, capacitors and other electronic components of the cameramodule are embedded in the electrical support which can prevent themodule getting dirty from solder resist, dust, etc. so as to efficientlyimprove the product quality.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe production of the camera module can use imposition manner which issuitable for high efficient massive production.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe electrical support substitutes the base in conventional cameramodule which can reduce the inclination of module caused by the base soas to improve the product quality.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe camera module has a small size and a securely connecting structure.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe camera module has a small overall dimension, wherein the height ofthe camera module can be reduced 0.25 mm comparing with the conventionalCOB packaging method and the overall dimensions can be reduced more than0.5 mm.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe camera module manufacturing process is simplified, wherein thedriver is directly attached to the circuit board, which reduces thesoldering process, shorten the production cycle and reduces productioncosts.

Another object of the present invention is to provide a camera modulewith electrical support and the manufacturing method thereof, whereinthe electrical support has strong market competitiveness, thus enhancethe market competitiveness of the camera module using the electricalsupport, and further enhance the market competitiveness of theelectronic equipment using the camera module in high-end productsmarket.

Additional advantages and features of the invention will become apparentfrom the description which follows, and may be realized by means of theinstrumentalities and combinations particular point out in the appendedclaims.

According to the present invention, the foregoing and other objects andadvantages are attained by an electrical support, wherein the electricalsupport is used on a camera module. The electrical module comprises asupport body and a circuit arrangement, wherein the circuit arrangementis provided on the support body to form an integral structure, whereinthe electrical support integrated the base and the circuit board inconventional camera module.

In one embodiment, the circuit arrangement is embedded in the supportbody.

In one embodiment, the circuit arrangement comprises at least aconductive member and at least an electronic component, wherein theconductive member is electrically connected with the electroniccomponent in a default method.

In one embodiment, the support body further comprises at least aconnecting element which is electrically connected to the conductivemember and the electronic component.

In one embodiment, the connecting element is provided on the surface ofthe support body.

In one embodiment, the connecting element further comprises at least aphotosensitive sensor conductive member which is used in the cameramodule to electrically connect the photosensitive sensor with theconductive member and the electronic component.

In one embodiment, the photosensitive sensor conductive member isembodied as a photosensitive sensor terminal.

In one embodiment, the connecting element further comprises at least adriver conductive member which is used in the driver of the cameramodule to electrically connect the driver with the conductive member andthe electronic component.

In one embodiment, the driver conductive member is embodied as a driverterminal.

In one embodiment, the connecting element further comprises at least aflexible PCB conductive member which is used in a flexible PCB of thecamera module to electrically connect the flexible PCB with theconductive member and the electronic component.

In one embodiment, the flexible PCB conductive member is embodied as aflexible PCB terminal.

In one embodiment, the electrical support further comprises at least anelectrical component, and the connecting element further comprises atleast an electrical conductive member which is used to electricallyconnect the electrical component with the conductive member and theelectronic component.

In one embodiment, the electrical conductive member is embodied as anelectrical member terminal.

In one embodiment, the support body has a first top surface, a firstbottom surface, a second top surface and a second bottom surface,wherein the connecting element is provided on each of the first topsurface, the first bottom surface, the second top surface and the secondbottom surface of the support body.

In one embodiment, the driver conductive member is provided on thesecond top surface.

In one embodiment, the photosensitive sensor conductive member isprovided on the first bottom surface.

In one embodiment, the flexible PCB conductive member is provided on thesecond bottom surface.

In one embodiment, the flexible PCB conductive member is provided on thesecond top surface.

In one embodiment, the electrical component and the electricalconductive member are provided on the first top surface.

In one embodiment, the electrical support comprise a top recess, athrough hole and a bottom recess, wherein the top recess and the bottomrecess are used for assembling an optical filter and a photosensitivesensor of the camera module.

In one embodiment, the support body comprises a first support member anda second support member. The first support member has the first topsurface and the first bottom surface. The second support member has thesecond top surface and the second bottom surface. The first top surfaceis indented from the second top surface.

In one embodiment, the first top surface is on the same plane with thesecond top surface.

In one embodiment, the first bottom surface is indent from the secondbottom surface.

In one embodiment, the first bottom surface is on the same plane withthe second bottom surface.

In one embodiment, wherein the support body has a through hole, whereinthe photosensitive sensor and the filter lens are mounted on theopposite side of the camera module respectively.

In accordance with another aspect of the invention, the presentinvention comprises a camera module which further comprises:

an optical lens,

a photosensitive sensor; and

an electrical support;

wherein the optical lens is located along an photosensitive path of thephotosensitive sensor, and the electrical support supports thephotosensitive sensor.

In one embodiment, the camera module further comprises a driver, whereinthe optical lens is provided at the driver.

In one embodiment, the photosensitive sensor is electrically connectedto the circuit arrangement of the electrical support.

In one embodiment, the camera module further comprises an opticalfilter, wherein the optical filter is provided between the optical lensand the photosensitive sensor.

In one embodiment, the driver is soldered to or attached to theelectrical support.

In one embodiment, the photosensitive sensor is provided on the bottomside of the support body of the electrical support and electricallyconnected to the circuit arrangement of the electrical support. Thephotosensitive sensor is assembled by using flip chip method.

In one embodiment, the photosensitive sensor and the electrical supportare assembled using all possible methods such as ACP (anisotropicconductive paste), ultrasonic welding, thermo-compression bonding andreflow soldering.

In one embodiment, the camera module further comprises a flexible PCB,wherein the flexible PCB is provided on the top side or the bottom sideof the support body of the electrical support, wherein the flexible PCBis electrically connected to the circuit arrangement of the electricalsupport.

In accordance with another aspect of the invention, the presentinvention comprises a manufacturing method of a camera module, whichcomprises the steps of:

(a) supporting a photosensitive sensor at an electrical support; and

(b) supporting an optical lens and positioning the photosensitive sensoralong a photosensitive path of the optical lens.

In one embodiment, the manufacturing method the camera module furthercomprises a step of:

providing a circuit arrangement in a support body to form the electricalsupport.

In one embodiment, the manufacturing method the camera module furthercomprises a step of:

forming laminated resin on a reinforcing member, such as reinforcingsteel plate or a copper plate, to form a first support member, a secondsupport member and a through hole, wherein the first support member andthe second support member are integrally connected to form the supportbody.

In one embodiment, the circuit arrangement is embedded in the supportbody.

In one embodiment, the circuit arrangement comprises a plurality ofconductors and a plurality of electrical components, wherein theconductors are embedded in the support body and is electricallyconnected with the electrical components.

In one embodiment, the manufacturing method of the camera module furthercomprises a step of:

providing a plurality of photosensitive sensor conductive members on thesurface of the support body, so that the circuit arrangement and thephotosensitive sensor are electrically connected.

In one embodiment, the manufacturing method of the camera module furthercomprises the steps of:

providing a plurality of driver conductive members on the surface of thesupport body;

coupling the optical lens with a driver to form a zoom camera module;and

coupling the driver on the electrical support and electricallyconnecting the circuit arrangement with the driver via at least onedriver conductive member.

In one embodiment, the manufacturing method of the camera module furthercomprises the steps of:

forming a plurality of flexible PCB conductive members on the surface ofthe support body; and

coupling the flexible PCB on the electrical support and electricallyconnecting the circuit arrangement and the flexible PCB through theflexible PCB conductive members.

In one embodiment, the photosensitive sensor is provided on theelectrical support, wherein the electrically connecting method of thephotosensitive sensor and the circuit arrangement is selected from theACP (anisotropic conductive paste) and soldering.

In one embodiment, the flexible PCB is provided on the electricalsupport, wherein the electrically connecting method of the flexible PCBand the circuit arrangement is selected from the ACP (anisotropicconductive paste) and soldering.

In one embodiment, the driver is provided on the electrical support,wherein the electrically connecting method of the driver and the circuitarrangement is selected from the ACP (anisotropic conductive paste) andsoldering.

In one embodiment, the photosensitive sensor is attached to theelectrical support, wherein the electrically connecting method isselected ACP (anisotropic conductive paste), ultrasonic welding,thermo-compression bonding and reflow soldering.

In one embodiment, the flexible PCB is attached to the electricalsupport, wherein the electrically connecting method is selected ACP(anisotropic conductive paste), ultrasonic welding, thermo-compressionbonding and reflow soldering.

In one embodiment, the driver is attached to the electrical support,wherein the electrically connecting method is selected ACP (anisotropicconductive paste), ultrasonic welding, thermo-compression bonding andreflow soldering.

In one embodiment, the manufacturing method of the camera module furthercomprises the steps of:

providing a plurality of electrical conductive members on the surface ofthe support body; and

providing a plurality of electrical components on the electricalsupport, wherein the electrical components are electrically connected tothe circuit arrangement by the electrical conductive members.

In one embodiment, the electrical components are attached to theelectrical support, wherein the electrically connecting method issoldering.

In one embodiment, each of the electrical components is at least one ofresistors, capacitors, and the driver elements in one or several.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the accompanying drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a conventional camera module.

FIG. 2 is a sectional view of a camera module according to a preferredembodiment of the present invention.

FIG. 3 is an exploded perspective view of the camera module according tothe above preferred embodiment of the present invention.

FIGS. 4A and 4B illustrate an electrical support of the camera moduleaccording to the above preferred embodiment of the present invention.

FIGS. 5A and 5B illustrate a first alternative mode of the electricalsupport of the camera module according to the above preferred embodimentof the present invention.

FIGS. 6A and 6B illustrate a second alternative mode of the electricalsupport of the camera module according to the above preferred embodimentof the present invention.

FIGS. 7A and 7B illustrate a third alternative mode of the electricalsupport of the camera module according to the above preferred embodimentof the present invention.

FIGS. 8A and 8B illustrate a manufacturing method of the camera moduleaccording to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to those skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

Referring to FIGS. 2 and 3, a system level camera module according to apreferred embodiment of the present invention is illustrated. The cameramodule comprises am electrical support 10, a flexible PCB 20, aphotosensitive sensor 30 such as a photosensitive chip, an optical lens40 and a driver 50 such as a motor. It is worth mention that the driver50 serves as a focusing mechanism, such that the system level cameramodule of the present invention can be an auto-focus camera module. Thecamera module of the present invention can also function without thedriver 50, so that the camera module is a fixed focus camera module.

The optical lens 40 is mounted at the driver 50, and the optical lens 40can be driven by the driver 50 for automatically focusing. The opticallens 40 is located along the photosensitive path of the photosensitivesensor 30, so that when the camera module is operated for capturingimage, the light reflected by the object can be further accepted by thephotosensitive sensor 30 for photoelectric conversion after passingthrough the optical lens 40. According to the preferred embodiment ofthe present invention, the electrical support 10 is connected with theflexible PCB 20 and the driver 50. In other words, the electricalsupport 10 serves as an integration of a base and a PCB in aconventional camera module, wherein the electrical support 10 forms anassembling means for connecting the driver 50 and the optical lens 40and forms an electrical connection means for electrically connecting tothe driver 50, the photosensitive sensor 30 and the flexible PCB 20 witheach other.

Referring to FIGS. 4A and 4B, the electrical support 10 furthercomprises a support body 11, one or more connecting members 12, acircuit arrangement 13, and a through hole 100. According to thepreferred embodiment of the present invention, the support body 11further comprises a first support member 111 defining the through hole100 therein and a second support member 112, wherein the first supportmember 111 is indented from the second support member 112. Forunderstanding easily, one portion of the support body 11 is defined asthe first support member 111 and another portion of the support body 11is defined as the second member 112. In fact, the first support member111 and the second member 112 are integrated with each other during themanufacturing process. The support body 11 has a first top surface 1111,a first bottom surface 1112, a second top surface 1121 at a level higherthan the first top surface 1111, and a second bottom surface 1122 at alevel lower than the first bottom surface 1112. Specifically, the firsttop surface 1111 and the first bottom surface 1112 are defined at thefirst support member 111 of the support body 11, while the second topsurface 1121 and the second bottom surface 1122 are defined at thesecond support member 112 of the support body 11. The circuitarrangement 13 is provided on the support body 11. Specifically, thecircuit arrangement 13 is embedded in the support body 11.

The circuit arrangement 13 comprises a plurality of electricalconductors 131 and a plurality of electronic elements 132, wherein theelectrical conductors 131 are pre-connected with the electronic elements132 in an electrically connecting manner. The circuit arrangement 13 ispre-connected at the support body 11 to electrically connect with thedriver 50, the flexible PCB 20 and the photosensitive sensor 30, so thateach camera component of the camera module is electrically connectedwith each other in a predetermined method to make the camera modulehaving a preset function. The connecting member 12 is electricallyconnected with the electrical conductors 131 and the electronic elements132, wherein the electronic elements 132 can be a variety of resistors,capacitors or driver components.

The photosensitive sensor 30 is coupled on the support body 11 of theelectrical support 10 and is electrically connected with the circuitarrangement 13 and the flexible PCB 20. Specifically, thelight-sensitive 30 is mounted on the flexible PCB 20, wherein thephotosensitive sensor 30 is electrically connected to the flexible PCB20 by the circuit arrangement 13 of the electrical support 10.

According to the preferred embodiment of the present invention, thecamera module further comprises a plurality of electric components 80which can be a variety of resistors, capacitors or driver components,and all these electric components can be protruded from the first topsurface 1111. One skilled in the art can understand that the cameramodule comprises a plurality of electric components 80 is exemplary onlyand not intended to be limiting. In real practical application, theelectronic elements and the electric components can be providedembedding in the electrical support 10, and also can be provided on andprotruded from the surface of the electrical support 10.

The connecting member 12 is provided on the support body 11 andelectrically connected with the photosensitive sensor 30, the driver 50and the flexible PCB 20 of the camera module. Specifically, theconnecting member 12 can be provided on different surfaces of thesupport body 11, which can be the first top surface 1111, the firstbottom surface 1112, the second top surface 1121 and the second bottomsurface 1122, so that the photosensitive sensor 30, the driver 50 andthe flexible PCB 20 are electrically connected with each otherrespectively. More specifically, the connecting member 12 comprises aplurality of electric component conductive members 121, a plurality ofdriver conductive members 122, a plurality of photosensitive sensorconductive members 123 and a plurality of flexible PCB conductivemembers 124 which are used to connect and conduct the electriccomponents 80, and the driver 50, the photosensitive sensor 30 and theflexible PCB 20 respectively.

The electric component conductive members 121, the driver conductivemembers 122, the photosensitive sensor conductive members 123 and theflexible PCB conductive members 124 are all alignedly provided on thesurfaces of the support body 11, which are the first top surface 1111,the first bottom surface 1112, the second top surface 1121 and thesecond bottom surface 1122. More specifically, the electric componentconductive members 121 are provided on the first top surface 1111, suchthat the electric component 80 can be easily provided on the first topsurface 1111 and electrically connected with the circuit arrangement 13of the electrical support 10. The driver conductive members 122 areprovided on the second top surface 1121 for easily providing the driver50 on the second top surface 1121 and electrically connecting with thecircuit arrangement 13 of the electrical support 10. The photosensitivesensor conductive members 123 are provided on the first bottom surface1112 for easily providing the photosensitive sensor 30 on the firstbottom surface 1112 and electrically connecting with the circuitarrangement 13 of the electrical support 10. The flexible PCB conductivemembers 124 are provided on the second bottom surface 1122 for easilyproviding the flexible PCB 20 on the second bottom surface 1122 andelectrically connecting with the circuit arrangement 13 of theelectrical support 10.

The driver conductive members 122 are used to electrically connect thedriver 50 with the circuit arrangement 13, so that the driver 50 can beactuated to further drive the optical lens 40 for adjustment of thecamera module.

The photosensitive sensor conductive members 123 are electricallyconnected with the circuit arrangement 13. The flexible PCB conductivemembers 124 are electrically connected with the circuit arrangement 13.The photosensitive sensor 30 comprises a plurality of photosensitivesensor conductive elements 31 and a photosensitive sensor body 32,wherein the photosensitive sensor conductive elements 31 are provided onthe photosensitive sensor body 32. It is worth mentioning that thepositions of the photosensitive sensor conductive elements 31 on thephotosensitive sensor body 32 are corresponding to the locations of thephotosensitive sensor conductive members 123 on the electrical support10. When the photosensitive sensor 30 is mounted on the electricalsupport 10, the photosensitive sensor 30 is electrically connected tothe circuit arrangement 13 of the electrical support 10, and furtherelectrically connected with the flexible PCB 20. Preferably, thephotosensitive sensor 30 is mounted on the electrical support 10 usingflip chip method and without wire bonding process, wherein theconnecting method of photosensitive sensor conductive elements 31 andthe photosensitive sensor conductive members 123 can be but not limitedto ACP (anisotropic conductive paste), ultrasonic welding,thermo-compression bonding, reflow soldering, and etc.

The flexible PCB 20 comprises a plurality of PCB conductive elements 21and a PCB body 22, wherein the PCB conductive elements 21 are alignedlyprovided on the PCB body 22. It is worth mentioning that the locationsof the PCB conductive elements 21 on the PCB body 22 are correspondingto the locations of the PCB conductive members 124 on the electricalsupport 10. When the flexible PCB 10 is mounted on the electricalsupport 10, the flexible PCB 20 is electrically connected with thecircuit arrangement 13 of the electrical support 10, and furtherelectrically connected with the photosensitive sensor 30 and the driver50. More specifically, the PCB conductive elements 21 are electricallyconnected with the PCB conductive members 124 of the electrical support10, the electrical connecting method can be but not limited tosoldering.

It is worth mentioning that the division of the flexible PCB 20 and theelectrical support 10 is exemplary only and not intended to be limiting.According to other preferred embodiment of the present invention, theflexible PCB 20 can be integral with the electrical support 10. Inaddition, the flexible PCB 20 and the electrical support can be providedas an integral or separated according to the demands.

The driver 50 comprises a plurality of driver conductive elements 51 anda driver body 52, wherein the driver conductive elements 51 are providedon the driver body 52. It is worth mentioning that the locations of thedriver conductive elements 51 on the driver body 52 are corresponding tothe locations of the driver conductive members 122 on the electricalsupport 10. When the driver 50 is mounted on the electrical support 10,the driver 50 is electrically connected with the circuit arrangement 13of the electrical support 10, and further electrically connected withthe flexible PCB 20. More specifically, the driver conductive elements51 are electrically connected with the driver conductive members 122 ofthe electrical support 10, wherein the electrical connection method canbe but not limited to ACP (anisotropic conductive paste), ultrasonicwelding, thermo-compression bonding, reflow soldering, and etc.

According to the preferred embodiment of the present invention, theconnecting member 12 is embodied as a terminal which is the same part inconventional camera module to reduce the manufacturing cost of thecamera module. Specifically, each of the electric component conductivemembers 121 is embodied as an electric component terminal. Each of thedriver conductive members 122 is embodied as a driver terminal. Each ofthe photosensitive sensor conductive members 123 is embodied as aphotosensitive sensor terminal. Each of the flexible PCB conductivemembers 124 is embodied as a flexible PCB terminal. It is worthmentioning that, according to the preferred embodiment of the presentinvention, each of the connecting members 12 can also be embodied as asoldering pad. One skilled in art can understand that using thesoldering pad is exemplary only and not intended to be limiting.According to other embodiment of the present invention, the connectingmembers 12 can also embodied as any other possible method to achieveelectrical conduction.

Referring to FIG. 3, the camera module 30 further comprises an opticalfilter 70 which is used to filter out stray light, in order to furtherenhance the quality of the image. The first top surface 1111 is indentedfrom the second top surface 1121 to provide a top storing and protectivespace for the electric component 80 and the optical filter 70. The firstbottom surface 1112 is indented from the second bottom surface 1122 toalso provide a bottom storing and protective space for thephotosensitive sensor 30 and the flexible PCB 20.

Referring to FIGS. 2 and 3, the electrical support 10 is modified from aconventional PCB board in order to omit the base of the conventionalcamera module. The electrical support 10 has an integrally formed withPCB circuit, and provides a top recess 101 as the top storing andprotective space, the through hole 100, and a bottom recess 102 as thebottom storing and protective space inside the electrical support 10 inthis preferred embodiment, wherein the through hole 100 communicateswith the top recess 101 and the bottom recess 102. The inner diameter ofeach of the top recess 101 and the bottom recess 102 is larger than thatof the through hole 100, wherein the electrical support 10 has astepped-down stair configuration on the top and the bottom. In otherwords, the first top surface 1111 and the second top surface 1121 formeda non-coplanar stepped surface to form the top recess 101, while thefirst bottom surface 1112 and the second bottom surface 1122 formed anon-coplanar stepped surface to form the bottom recess 102.

The electric component 80 and the optical filter 70 are provided at thetop recess 101 of the electrical support 10, wherein the electricalsupport 10 is used to mount the optical filter 70. The photosensitivesensor 30 is provided at the bottom recess 102, wherein the outer topsurface is connected with the first bottom surface 1111 of theelectrical support 10 so that the photosensitive sensor 30 can use flipchip method to mount. One skilled in art can understand that the lighttravelling through the optical lens 40 will be filtered by the opticalfilter 70, and will then travels through the through hole 100 to reachthe photosensitive sensor 30.

One skilled in art will understand that positions arrangement of theabove mentioned electric component conductive members 121, the driverconductive members 122, the photosensitive sensor conductive members 123and the flexible PCB conductive members 124, the configuration of thefirst top surface 1111 opposite to the second top surface 1121, togetherwith the configuration of the first bottom surface 1112 opposite to thesecond bottom surface 1122 is exemplary only and not intended to belimiting. The invention includes all modifications encompassed withinthe spirit and scope of the present invention. According to otherembodiments of the present invention, there might be other ways ofsetting up, such as the first top surface 1111 is on the same plane withthe second top surface 1121.

FIGS. 5A and 5B illustrate an alternative mode of an electrical support10′ according to the preferred embodiment of the present invention.Besides the electrical support 10′, the structural configuration of thecamera module of the first alternative of the preferred embodiment isthe same as the preferred embodiment. As shown in the FIGS. 5A and 5B,the electrical support 10′ comprises a support body 11′, one or moreconnecting members 12′ and a through hole 100′. According to the firstalternative embodiment of the present invention, the support body 11′comprises a first support member 111′ and a second support member 112′,wherein the first support member 111′ and the second support member 112′is integrally formed. The support body 11′ has a first top surface1111′, a first bottom surface 1112′, a second top surface 1121′ andsecond bottom surface 1122′. Specifically, the first top surface 1111′and the first bottom surface 1112′ are defined at the first supportmember 111′ of the support body 11′, while the second top surface 1121′and the second bottom surface 1122′ are defined at the second supportmember 112′ of the support body 11′. The circuit arrangement 13 isembedded in the support body 11′.

The connecting member 12′ comprises a plurality of electric componentconductive members 121′, a plurality of driver conductive members 122′,a plurality of photosensitive sensor conductive members 123′ and aplurality of flexible PCB conductive members 124′ for connecting andconducting the electric components 80, and the driver 50, thephotosensitive sensor 30 and the flexible PCB 20 respectively.

The electric component conductive members 121′ are provided on the firsttop surface 1111′, while the driver conductive members 122′ are providedon the second top surface 1121′. The flexible PCB conductive members124′ are provided on the second top surface 1121′, while thephotosensitive sensor conductive member 123′ are provided on the firstbottom surface 1112′. The first top surface 1111′ is indented from thesecond top surface 1121′. The first bottom surface 1112′ is indentedfrom the second bottom surface 1122′.

FIGS. 6A and 6B illustrate a second alternative mode of an electricalsupport 10″ of the camera module according to the preferred embodimentof the present invention. Besides the electrical support 10″, thestructural configuration of the camera module according to the secondalternative is the same as the preferred embodiment. As shown in FIGS.6A and 6B, the electrical support 10″ comprises a support body 11″, oneor more connecting members 12″ and a through hole 100″. According to thesecond alternative embodiment of the present invention, the support body11″ comprises a first support member 111″ and a second support member112″, wherein the first support member 111″ and the second supportmember 112″ is integrally formed. The support body 11″ has a first topsurface 1111″, a first bottom surface 1112″, a second top surface 1121″and second bottom surface 1122″. Specifically, the first top surface1111″ and the first bottom surface 1112″ are defined at the firstsupport member 111″ of the support body 11″, while the second topsurface 1121″ and the second bottom surface 1122″ are defined at thesecond support member 112″ of the support body 11″. The circuitarrangement 13 is embedded in the support body 11″.

The connecting member 12″ comprises a plurality of electric componentconductive members 121″, a plurality of driver conductive members 122″,a plurality of photosensitive sensor conductive members 123″ and aplurality of flexible PCB conductive members 124″ for connecting andconducting the electric components 80, and the driver 50, thephotosensitive sensor 30 and the flexible PCB 20 respectively.

The electric component conductive members 121″ are provided on the firsttop surface 1111″. The driver conductive members 122″ are provided onthe second top surface 1121″. The flexible PCB conductive member 124″ isprovided on the second top surface 1121″. The photosensitive sensorconductive members. 123″ are provided on the first bottom surface 1112″.The first top surface 1111″ is on the same plane with the second topsurface 1121″, which form an integral top surface at the same level. Thefirst bottom surface 1112″ is on the same plane with the second bottomsurface 1122″, which form an integral bottom surface at the same level.The photosensitive sensor 30 is mounted on the bottom of the electricalsupport 10″ using flip chip method.

FIGS. 7A and 7B illustrate a third alternative mode of an electricalsupport 10″ of the camera module according to the preferred embodimentof the present invention. Besides the electrical support 10′″, thestructural configuration of the camera module according to the thirdalternative is the same as the preferred embodiment. As shown in FIGS.7A and 7B, the electrical support 10′″ comprises a support body 11′″,one or more connecting members 12′″ and a through hole 100′″. Accordingto the third alternative embodiment of the present invention, thesupport body 11′″ comprises a first support member 111′″ and a secondsupport member 112′″, wherein the first support member 111′″ and thesecond support member 112′″ is integrally formed. The support body 11′″has a first top surface 1111′″, a first bottom surface 1112′″, a secondtop surface 1121′″ and second bottom surface 1122′″. Specifically, thefirst top surface 1111′″ and the first bottom surface 1112′″ are definedat the first support member 111′″ of the support body 11′″, while thesecond top surface 1121′″ and the second bottom surface 1122′″ aredefined at the second support member 112′″ of the support body 11′″. Thecircuit arrangement 13 is embedded in the support body 11′″.

The connecting member 12′″ comprises a plurality of electric componentconductive members 121′″, a plurality of driver conductive members122′″, a plurality of photosensitive sensor conductive members 123′″ anda plurality of flexible PCB conductive members 124′″ for connecting andconducting the electric components 80, and the driver 50, thephotosensitive sensor 30 and the flexible PCB 20 respectively.

The electric component conductive members 121′″ are provided on thefirst top surface 1111′″. The driver conductive members 122′″ areprovided on the second top surface 1121′″. The photosensitive sensorconductive members 123′″ are provided on the first bottom surface1112′″. The flexible PCB conductive members 124′″ are provided on thesecond bottom surface 1122′″. The first top surface 1111′″ is on thesame plane with the second top surface 1121′″, which form an integraltop surface at the same level. The first bottom surface 1112′″ is on thesame plane with the second bottom surface 1122′″, which form an integralbottom surface at the same level. The photosensitive sensor 30 ismounted on the bottom of the electrical support 10′″ using flip chipmethod.

In the overall structural scheme, the present invention has some newfeatures over the conventional COB package as the following.

1. For the camera module serving as an autofocus camera module, when thedriver is mounted to the electrical support, the electrical property ofboth parts is conducted by the driver soldering pad and the driverconductive member. The conductive method could be soldering, andpreferably using conductive silver paste. Thus after the mounting of thedriver, no further soldering process is needed.

2. The optical filter is mounted on the surface of the electricalsupport instead of attaching to an interior of the lens or a separatebase.

3. The photosensitive sensor is mounted to the electrical support byusing flip chip method. And the wire bonding process could be omitted.For example, the connecting method of the photosensitive sensorconductive element 31 and the photosensitive sensor conductive member123 could be but not limited to ACP (anisotropic conductive paste),ultrasonic welding, thermo-compression bonding, reflow soldering, andetc.

4. More than one set of conductive point is provided on the outside ofthe electrical support, such as (1) the driver conductive soldering pad,(2) the flexible conductive soldering pad, and (3) the photosensitivesensor conductive soldering pad inside the electrical support.

5. Resistors, capacitors and driver IC can be embedded into theelectrical support with predetermined shape, thus the design of theelectrical support is flexible.

Referring to FIGS. 8A and 8B, a manufacturing method of a electricalsupport according to present invention is illustrated. As shown in FIGS.8A and 8B, the manufacturing method of the camera module comprises thefollowing steps.

S1: installing the resistors, capacitors and other electric componentswith SMT technology;

S2: installing the photosensitive sensor;

S3: intalling the optical filter;

S4: assembling the driver with the electrical support;

S5: installing the ACF/Hot bar; and

S6: testing the function of the camera module.

Wherein in the step S1, SMT refers to surface mount technology.Specifically, this step is the step to integrally form the electricalsupport 10, 10′, 10″, 10′″ in the embodiment and its alternatives.

Step S2 refers to a step of installing the photosensitive sensor to theelectrical support 10, 10′, 10″, 10′″ in the embodiment and itsalternatives.

Step S3 refers to a step of installing the optical filter to theelectrical support 10, 10′, 10″, 10′″ in the embodiment and itsalternatives.

Step S4 refers to a step of installing the driver to the electricalsupport 10, 10′, 10″, 10′″ in the embodiment and its alternatives. Oneskilled in the art will understand for those fixed focal camera modulewhich does not equipped with a driver, the step S4 could be omitted.Alternatively, the optical lens 40 is mounted to the electrical support10 directly.

In step S5, the ACF refers to Anisotropic Conductive Adhesive. The Hotbar refers to a pulse heating reflow soldering heating head which isused to solder related electric parts. Specifically, the step S5 refersto a step of electrically connecting the electric component 80, thephotosensitive sensor 30, the optical filter 70 and/or the driver 50 tothe electrical support 10, 10′, 10″. 10′″ in the embodiment and itsalternatives, the connecting method could be but not limited to ACP(anisotropic conductive paste) and soldering.

Step S6 refers to a step of functional test of the assembled cameramodule which is formed from the previous steps.

It is worth mentioning that the step S2 and the step S3 areinterchangeable.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention includes allmodifications encompassed within the spirit and scope of the followingclaims.

What is claimed is:
 1. A camera module, comprising: an optical lens; aphotosensitive sensor, wherein said optical lens is positioned along anphotosensitive path of said photosensitive sensor; an electricalsupport, which comprises: a support body that supports said opticallens, wherein said support body has a first top surface and a second topsurface at level higher than said first top surface to form a step-downstair configuration, a circuit arrangement, which comprises a pluralityof electrical conductors and a plurality of electronic elements whichare electrically connected to each other, integrally embedded in saidsupport body and conductively connected with said photosensitive sensor,and a connecting member comprising a plurality of photosensitive sensorconductive members formed on a surface of said support body provided atsaid support body and electrically connected with said circuitarrangement, wherein said photosensitive sensor is coupled with saidsupport body at a position within said support body and electricallyconnected to said photosensitive sensor conductive members toelectrically connect with said circuit arrangement, whereby said supportbody forms a circuit board to electrically connect with saidphotosensitive sensor and serves as a base to support saidphotosensitive sensor; a PCB, wherein said connecting member furthercomprises a plurality of PCB conductive members formed on said surfaceof said support body and electrically connected to said PCB, so as toelectrically connect said PCB with said circuit arrangement; a drivercoupling with said optical lens, wherein said connecting member furthercomprises a plurality of driver conductive members formed on saidsurface of said support body and electrically connected to said driver,so as to electrically connect said driver with said circuit arrangement;and an electric component mounted on the first top surface of saidsupport body and a plurality of electric component conductive membersformed on said first top surface of said support body and electricallyconnected to said electric component with said circuit arrangement,wherein said electric component conductive members are formed on saidfirst top surface and said driver conductive members are formed on saidsecond top surface of said support body.
 2. The camera module, asrecited in claim 1, wherein said support body further has a first bottomsurface to form a step-down stair configuration, wherein saidphotosensitive sensor conductive members are formed on said first bottomsurface and said PCB conductive members are formed on said second bottomsurface.
 3. A method of manufacturing of a camera module, comprising thesteps of: (a) forming an electrical support by the steps of: (a.1)integrally embedding a circuit arrangement in a support body, whereinsaid circuit arrangement comprises a plurality of electrical conductorsand a plurality of electronic elements which are pre-connected with saidelectrical conductors in an electrically connecting manner; (a.2)forming a plurality of photosensitive sensor conductive members on asurface of said support body and electrically connecting saidphotosensitive sensor conductive members with said circuit arrangement;and (a.3) forming a plurality of PCB conductive members on said surfaceof said support body and electrically connecting said PCB conductivemembers with said circuit arrangement; (b) supporting a photosensitivesensor within said support body and electrically connecting saidphotosensitive sensor within said support body and electricallyconnecting said photosensitive sensor to said photosensitive sensorconductive members, such that said support body forms a circuit board toelectrically connect with said photosensitive sensor and serves as abase to support said photosensitive sensor; (c) providing a PCB which iselectrically connected to said PCB conductive members so as toelectrically connect said PCB with said circuit arrangement; (d)supporting an optical lens along a photosensitive path of saidphotosensitive sensor; and (e) supporting an optical filter at a topside of said electrical support while said photosensitive sensor isinstalled at a bottom side of said electrical support which has athrough hole extended through said top and bottom sides, wherein saidsupport body has a first top surface and a second top surface at a levelhigher than said first top surface to form a step-down stairconfiguration, wherein said electric component conductive members areformed on said first top surface and said driver conductive members areformed on said second top surface.
 4. A method a manufacturing of acamera module, comprising the steps of: (a) forming an electricalsupport by the steps of: (a.1) integrally embedding a circuitarrangement in a support body, wherein said circuit arrangementcomprises a plurality of electrical conductors and a plurality ofelectronic elements which are pre-connected with said electricalconductors in an electrically connecting manner; (a.2) forming aplurality of photosensitive sensor conductive members on a surface ofsaid support body and electrically connecting said photosensitive sensorconductive members with said circuit arrangement; (a.3) forming aplurality of PCB conductive members on said surface of said support bodyand electrically connecting said PCB conductive members with saidcircuit arrangement; and (a.4) forming a plurality of driver conductivemembers on said surface of said support body; (b) supporting aphotosensitive sensor within said support body and electricallyconnecting said photosensitive sensor to said photosensitive sensorconductive members, such that said support body forms a circuit board toelectrically connect with said photosensitive sensor and serves as abase to support said photosensitive sensor; (c) providing a PCB which iselectrically connected to said PCB conductive members so as toelectrically connect said PCB with said circuit arrangement; (d)supporting an optical lens along a photosensitive path of saidphotosensitive sensor and providing a driver that couples with saidoptical lens, said plurality of driver conductive members formed on saidsurface of said support body electrically connecting said driverconducive members to said driver, so as to electrically connect saiddriver with said circuit arrangement; and (e) supporting an opticalfilter at a top side of said electrical support while saidphotosensitive sensor is installed at a bottom side f said electricalsupport which has a through hole extended through said top and bottomsides, wherein said support body has first top surface and a second topsurface at a level higher than said first top surface to form astep-down stair configuration, wherein said electric componentconductive members are formed on said first top surface and said driverconductive members are formed on said second top surface.